Samsung Galaxy S6 to feature new antenna technology to avoid metal chassis interference

Samsung’s A-series phones Galaxy A3 and Galaxy A5 suffered from weak signal strengths because of their all-metal bodies. The Korean company’s upcoming flagship Galaxy S6 is also supposed to feature an aluminum metal body. So Samsung is planning to use a new antenna technology in the Galaxy S6 that will prevent interference to signals from the metal chassis.

According to Korean media, Samsung is switching from existing LDS (Laser Direct Structuring) Antenna to FPCB (flexible Printed Circuit Board) antenna in the Galaxy S6 which will enable signal to pass through without any interference from its metal frame.

FPCB antennas have been used only as NFC antennas as their performance is inferior to LDS antennas. But with many technological advances made, their performance has improved and they are now being considered for main antennas especially as LDS antennas face problems with electromagnetic interference when fitted inside a metal chassis.

FPCB antennas are smaller and shaped like a sticker. They are made of metal and are thinner compared to NFC antennas. The cost of producing FPCB antennas is less than LDS antennas and they offer better performance. FPCB antennas are flexible, foldable, allow 3D wiring structure and can fit in any space inside the device.

With this new FPCB antenna, Samsung Galaxy S6 will not face any interference in signals on account of its metal chassis.

 

Source BusinessKorea

Samsung Galaxy S6 to feature new antenna technology to avoid metal chassis interference

First images of Huawei Ascend P8 with metal chassis leaks

Looking to the global availability of the devices, the Huawei Ascend P7 is the thinnest device currently available in the market. This flagship from Chinese manufacturer Huawei has turned out to be quite a successful device in the market and now rumors for its successor have started floating. Yes! We are talking about the Huawei Ascend P8 whose first images showing up the metal chassis of the handset have leaked. Additionally, these rumors also claim the device to be launching in March next year.

Back in November, there was a rumor claiming the Ascend P8 to be having a thin metal body like the P7. Now couple of images for the Ascend P8 have turned up showing up the metal chassis in the built of the smartphone.

Chinese website CNMO has claimed that the handset would be launching sometime in March 2015 with a bit larger 5.2inch 1080p display instead of the 5inch in the P7. Additional rumors have claimed it to be having a octa-core Kirin 930 chipset with 3GB of RAM memory, 16GB of built-in storage and a fingerprint sensor alongwith.

The pricing for the smartphone can be expected to be around $500. Check out the leaked images below.

source: CNMO (translated)

First images of Huawei Ascend P8 with metal chassis leaks