New Qualcomm WiPower technology brings wireless charging to metal body mobile devices

Qualcomm has announced that it has developed a new technology by which devices with metal body can be charged wirelessly. The technology called Qualcomm WiPower can charge devices with metal exteriors wirelessly, thus eliminating the need for using wires, reducing the clutter.

Qualcomm WiPower complies with the new Rezence wireless power charging standard, not using the popular PMA or Qi standards. The Rezence standard has been developed by the Alliance for Wireless Power (A4WP) that includes leading brands from various industries like Qualcomm, Microsoft, Acer, Samsung, Lenovo, LG, Asus, Motorola, Intel, and many others as members.

Rezence was first demonstrated at the beginning of this year in January. With this standard, WiPower enables wireless charging of devices without any direct physical contact. You can even charge multiple devices having different power requirements when placed inside the same charge area. And not only charging, WiPower can also power devices such as wireless keyboard, mouse, digital photo frames and lamps.

Qualcomm WiPower works “at a frequency that is more tolerant of metal objects that come within the charge field”. So up till now, the charging process was not affected even if other metal objects such as coins or keys were lying inside the charge field. But now Qualcomm has added one more feature to WiPower, that the device to be charged could itself be made of metal. The new feature maintains the existing WiPower ability “to charge devices requiring up to 22 watts today, at speeds equal to or faster when compared to other wireless charging technologies”.

“Building a wireless charging solution into devices with metal exteriors is a significant step for moving the entire industry forward,” says Steve Pazol, GM, Wireless Charging of Qualcomm Incorporated.

It’s not clear when such WiPower-using mobile devices will be available in the market but we certainly hope to see them soon.

Check out the promo video for Qualcomm WiPower:

New Qualcomm WiPower technology brings wireless charging to metal body mobile devices

Qualcomm Finalized Snapdragon 820 Processor Chipset Specifications and Sending samples of it to Smartphone manufacturers

Qualcomm showcased the next upcoming Snapdragon 820 chipset in MWC (Mobile World Congres) which was held in March 2015 previously. Hopefully the chipset will be able to solve the overheating issue which plagued the predecessor Snapdragon 810 chipset.

Snapdragon 820 chipset is reported to be integrated with custom-designed 64-bit CPU cores called Kyro. If this information is correct then the cores will be clocked up to 3.0 GHz and will be manufactured using Samsung’s 14nm node manufacturing technology. With this information, it is hinted that Qualcomm will be partnering with Samsung instead of TSMC to manufacture its chipset. Beforehand, Qualcomm always partnered with TSMC to manufacture its chipset.

Some of the smartphone manufacturers which is going to test out the new chips are Sony, HTC and Xiaomi. Xiaomi is reported to use Snapdragon 820 chipset in the company’s next flagship smartphone Mi 5. The Xiaomi smartphone will be launched in October if everything going according to plan.

Since Snapdragon 820 is going to use Samsung’s 14nm node process which is the same process that Samsung did for the company’s own Exynos 7420 chipset and already being used for Galaxy S6 series, it seems like it is going to solve the overheating issue which found in Snapdragon 810. Snapdragon 810 was manufactured by TSMC on 20nm technology.

Qualcomm Finalized Snapdragon 820 Processor Chipset Specifications and Sending samples of it to Smartphone manufacturers

Qualcomm Sense ID – The New Ultra-sonic Fingerprint Sensors

Other than launching its glamorous new flagship-grade system on a chip the Snapdragon 820, Qualcomm recently – for its Snapdragon devices – introduced new Sense ID fingerprint technology.

Sense ID is a new kind of biometric identification technology in which ultrasonic sound waves are used to capture a complete diagram of user’s fingerprint, even more detailed figure than a person normally gets in its capacitive fingerprint sensors (for example, just like the one used in iPhone 6).

In order to work, Sense ID technology does not need a completely spotless finger. The new higher-resolution Sense ID is excellent for security because it allows reading details as low as pores and ridges, and in addition now user’s fingerprint can easily get accepted even with dirt or moist on the finger.

The new technology of Qualcomm is also workable through glass and sapphire, which means that it can be integrated in phone’s different places.

The Snapdragon Sense ID of Qualcomm will finally be introduced in devices carrying Snapdragon 425 and Snapdragon 810, while the compatible devices list includes 800, 600, and 400 series of Snapdragon chips.

Senior vice president Raj Talluri at Qualcomm subsidiary QTI said, “Snapdragon Sense ID 3D Fingerprint Technology’s unique use of ultrasonic technology revolutionizes biometrics from 2D to 3D, allowing for greater accuracy, privacy and stronger authentication.”

He further stated that we were quite excited that we launched the first ultrasonic-based biometric authentication technology in the industry of mobile for the mobile device producers to give their customers new enhanced and discriminated experience.

Qualcomm Sense ID – The New Ultra-sonic Fingerprint Sensors

Qualcomm unveils Snapdragon 820 with Kryo 64-bit CPU

Qualcomm announced its new chipset, the Snapdragon 820 at its keynote at the MWC in Barcelona. This next gen SoC from Qualcomm utilizes its new Zeroth platform. Now we can expect to see the new Snapdragon 820 chipset in upcoming Android and Windows phones, but it will take a while yet.

Qualcomm revealed its new Zeroth platform which it described as a “cognitive computing platform” which will make its debut with Snapdragon 820. According to the company, Zeroth contains many new hardware and software technologies that will offer a more intuitive and natural experience by anticipating users’ gestures and needs in advance and take appropriate actions. Qualcomm demonstrated a real-life application on stage that consisted of a camera recognizing the subject of the photo.

The FinFET manufacturing process will be used to build the Snapdragon 820 but the company has not disclosed which technology they will be using, Samsung’s 14nm or TSMC’s 16nm. The new chipset uses Qualcomm’s new 64-bit custom ARMv8 CPU called the Kryo. No other details about it are known for the present.

The new Snapdragon 820 processor will start sampling in the 2nd half of 2015 which indicates that the first smartphone and tablets carrying the chip will make an appearance somewhere in early 2016.

 

 

Source GSMArena

Qualcomm unveils Snapdragon 820 with Kryo 64-bit CPU

Four New Types of Snapdragon Chipsets from Qualcomm

Recently Qualcomm has introduced four new types of Snapdragon chipsets, Snapdragon 415, 425, 618, and 620. With the new chipsets, Qualcomm promises that it will let user experience all the goodness of 4G LTE whether the user is a first time smartphone user or the most sophisticated cutting-edge users.

Snapdragon 415 and Snapdragon 425  are two new additions to the Snapdragon 400 family line. Both are octa-core chipsets, each comprises eight Cortex-A53 cores, based on a 28nm manufacturing process. On top of that, both of them are 64-bit processors and they come with two image signal processors (ISPs) which is design for a better camera performance.

As for the GPU, both chipsets are equipped with Adreno 405 GPU.  The GPU supports display output of up to 1200 x 1920 pixels, allowing hardware decoding of 1080p videos, and boasts support for DirectX 11.2. Unfortunately, support for DirectX is only applicable for smartphones running on Windows. The difference of Snapdragon 415 from 425 is the data transfer speeds. Snapdragon 415 offers X5 LTE which can support up to 150Mbps download speed/50Mbps upload speed whereas SnapDragon 425 offers X8 LTE which can support up to 300Mbps maximum download speed/100Mbps upload.

Snapdragon 618 is a 64-bit hexa-core chipset, which consists of four Cortex-A53 cores and two Cortex-A72 in a big.LITTLE architecture. However there is no detail on the GPU in this new chip yet, Qualcomm only explains that it will be the next gen Adreno series which is suspected to be the upcoming Adreno 500 series. The chipset will support 4K video recording and hardware decoding as well as resolutions of less than 1600 x 2560 pixels.

Snapdragon 620 offers eight cores – four Cortex-A72 ones and four Cortex-A53 ones, also in big.LITTLE architecture. It is similar to Snapdragon 618 – 2K internal display support, 4K recording and playback, as well as a next-gen Adreno graphics-crunching unit. Both Snapdragon 618 and Snapdragon 620 support X8 LTE modems, which means that they can support download speeds of up to 300Mbps and upload ones of no more than 100Mpbs . You can also pair these new chips with camera sensors that are no larger than 13MP in size.

Four New Types of Snapdragon Chipsets from Qualcomm

Qualcomm Predicts More 2K Smartphones Entering the Market this Year

The first few smartphones which comes with a 2K display is LG G3 and Samsung Galaxy Note 4. Both of the device was launched within last year. Qualcomm predicted that more and more smartphones especially the high end range product will come with a 2K display screen resolution, however, the company does not particularly say which manufacturer is it. With the MWC 2015 event which will be held in Barcelona drawing nearer, we can expect that the QHD technology will be turning into reality also.

Although 2K screens are set to hit the mainstream, however, the move of 4K screen on mobile phone will not happen anytime soon. The move of 4K screen is seen much more in the use for tablet display. Since the benefit of a 4K screen can be easily seen on the tablet more than it can be seen on mobile phone. The cost definitely will be lower too.

Executives from HTC, Huawei and Sony has expressed concern on the impact of using a high resolution screen on a mobile phone on the battery life. However, Qualcomm ensures that this concern can be easily solve by using an octa-core processors. Samsung, on the other hand, has perfected the use of 2K display resolution and moving towards 4K display resolution for production as early as next year.

 

Qualcomm Predicts More 2K Smartphones Entering the Market this Year

Samsung taking on Qualcomm by using its own Exynos chipset in Galaxy S6

Samsung is using its own Exynos chipsets instead of Qualcomm’s Snapdragon 810 in its new upcoming flagship smartphone Galaxy S6. It seems this decision of Samsung’s is not because of so-called overheating issues with Qualcomm’s latest SoC as alleged by the TSMC foundry, but is actually because the Korean company wants to take on the world famous chip maker with its 14nm technology.

According to the Korean media, industry sources say that both Snapdragon 810 and Exynos 7420 chipsets are already being incorporated in various new flagships. Samsung is using Exynos in its Galaxy S6 while Snapdragon 810 is being used in LG G Flex 2 and Xiaomi Mi Note. After some earlier mishaps with overheating of Samsung’s Exynos 5 series, Samsung began to use more of Qualcomm chipsets but now it is back with Exynos 7420 that will go into the Galaxy S6.

Samsung will be using the superior 14nm technology for manufacturing the Exynos 7420, while Qualcomm is still using the old 20nm process for its Snapdragon 810 and is moving on the 14nm process only this year. 14nm technology means smaller footprint, superior performance and lower power consumption which takes Samsung a step ahead of Qualcomm.

Qualcomm has of course announced that the heating problem with its Snapdragon 810 has been solved. Snapdragon SoCs are famous for their multi-band LTE modems, but Samsung has now developed its own LTE Cat. 9 radio which will actually be built on 20nm, while Qualcomm’s LTE radio is on 28nm. While Snapdragon 810 allows 4K encoding-decoding and streaming, it is not known what Exynos is capable of, but knowing Samsung, we needn’t be too worried.

 

Via PhoneArena

Samsung taking on Qualcomm by using its own Exynos chipset in Galaxy S6

Roadmap of Qualcomm’s plans of its Snapdragon chipsets for second-half of 2015 leaks

A leaked document has revealed the plans of chip making giant Qualcomm for the second half of this year 2015 showing up few details regarding what the devices 2015 could offer.

Just when Qualcomm has started shipping its Snapdragon 810 64bit chipset the news for its successor Snapdragon 820 are already out. The Snapdragon 820 is said to be coming with some very prominent advancements that include 14nm FinFet manufacturing system at Samsung and GlobalFoundries fabs in addition to bringing the Taipan architecture for the 64bit CPU cores. Till now in most of the Qualcomm chips they used Krait CPU cores, but with the transition to 64bit architecture for Snapdragon 810, Qualcomm was forced to leave its custom cores. The Snapdragon 820 is said to be an octa-core chipset having eight TS2 high-performance cores. Moreover, the new 14nm FinFet technology will surely give improved performance and better efficiency. Additionally, the Snapdragon 820 would also include a Adreno 530GPU along with the support to faster LPDDR4 RAM in addition to MDM9X55 LTE-A Cat.10 Qualcomm modem.

Apart from this, there is also an Snapdragon 815 chipset from the company that two comes with octa-core design. However, this is said to have big.LITTLE architecture with four TS1 and four TS2 cores. In this case, the GPU is said to be Andreno 450 with LPDDR4 RAM support and DM9X55 LTE-A Cat.10 Qualcomm modem. The Snapdragon 815 is said to be manufactured with a 20nm node.

Now coming to the mid-range category, Qualcomm has three chipset is plan: the Snapdragon 620, 625, and 629. The Snapdragon 625 and 629 are manufactured with 20nm HKMG Samsung/GF process and are octa-core SoC supported with Adreno 418 GPU. The design for the chipsets could be the company’s own made or have a ARM Cortex solution. The Snapdragon 620 would be a quad-core chipset with Taipan cores clocked anywhere between 2-2.5GHz offering support to LPDDR3 RAM.

Additionally, one more chipset the Snapdragon 616 is spotted that comes with eight ARM Cortex A53 cores running between 1.8GHz to 2.2GHz and supported with Adreno 408 graphics. This SoC would support LTE-A Cat 6 modem and is said to be made using the 28nm HKMG by Shanghai-basied Semiconductor Manufacturing International Company (SMIC) factory.

Well as time moves ahead we expect to see many handset in the second half of 2015 hosting this powerful machines. Take a look at the image below.

source: @leaksfly

Via: PhoneArena

Roadmap of Qualcomm’s plans of its Snapdragon chipsets for second-half of 2015 leaks

Taiwan based chip giant MediaTek plans to enter US markets

Taiwan based chip maker MediaTek needs no introduction as the company’s baked chipsets are found in most of the affordable smartphones sold by handset manufacturers across the globe. MediTek has a wide gain popularity in many affordable Chinese handset and has a strong foothold in the Asian market. Now the company seems to be planning to move a step further and venture into the US markets by opening up its first office in San Diego. This means MediaTek is also set to raise the competition further with its arch rival Qualcomm which too is established player in US market and across globe. However, for now it’s only T-Mobile carrier that is selling MediTek powered devices from Alcatel in the US markets.

However, Qualcomm is currently much ahead of the race hen it comes to market share globally, but it seems that the entry into US markets would surely help MediaTek bridge the gap. Making their business strategy clear, at CES 2015, company president Ching-Jiang Hsieh was heard saying “If you intend to be the most global [player] in the mobile business you should be selling a chip in North America.”

US carriers are often seeing pushin up their plans for new handsets and it could turn out to be a good opportunity for MediaTek to enter the affordable ranged handsets market in the country. However, this is certainly not going to be a cake walk as Qualcomm has already gained popularity here as well as its chips have made home to Lumia 535 and Moto G like handsets. Moreover, within the user community, MediaTek is much less popular compared to Qualcomm.

Jon Erensen, Gartner research director looks it as a good opportunity for MediTek in US market, but like Intel, MediaTek too will have tought fight with Qualcomm.

source: CNET

Taiwan based chip giant MediaTek plans to enter US markets

MediaTek Next Processor: 10-core or 12-core Processors

According to insider news, it is reported that MediaTek, a Taiwan-based chip manufacturer might be working on a 10-core or 12-core processors.  There are no further details on when the processors will starts the mass production or released to the public.  However, if everything is working according to plan, these processors will be used in the smartphone technology.

On the other side, currently there are not many apps which can support the advantages of 4-cores let alone 10-core or 12-core processors. therefore, there is not really a big different on the usage experience. However,it is indeed a big jump.

MediaTek’s competitor Qualcomm has released a mid-range Snapdragon 615 and high-range Snapdragon 810 which features 8-cores last year. Below is the video on Qualcomm’s opinion on MediaTek’s octa-core chips.

MediaTek Next Processor: 10-core or 12-core Processors

Qualcomm says an unknown Snapdragon 800 handset to be announced at the CES 2015

With just a week left for the biggest Consumer Electronic Show CES 2015 to commence, more news are now appearing from chip maker Qualcomm about the release of an Snapdragon 800 powered handset to be announced which has been kept suspense by the chip maker.

With the Qualcomm Snapdragon 810 chipset that is likely to make its debut very soon next year, the chip maker’s teaser with the Snapdragon 800 shows that the device can’t be a very premium flagship and hence we can expect some mid-range specs coming along with. The back panel image makes us to speculate that this could be a LG smartphone as it shows up some buttons on the back.

The most awaited and expected device form the LG camp to be announced at the CES 2015 is the LG G Flex 2. The successor is said to be a bit smaller than the LG G Flex, however it will still hold the same flexible display, curvy design and self-healing back cover.

source: Qualcomm

Qualcomm says an unknown Snapdragon 800 handset to be announced at the CES 2015

Some cool features of Qualcomm’s 64-bit Snapdragon 810 processor

Qualcomm’s Snapdragon processor powers a lot of our current smartphones. The company’s new Snapdragon 810 processor is set to enter most of the flagship Android smartphones and tablets in the coming year 2015, replacing the existing Snapdragon 801 and 805.

Qualcomm recently demoed some of the new features of Snapdragon 810 that will be seen in upcoming new devices. The 64-bit Snapdragon 810 is touted by the company to be the “ultimate connected computing processor” with modern capabilities. It has several new features and improved performances compared to earlier Snapdragon processors such as high resolution displays, 4K Ultra HD video streaming, advanced Wi-Fi connectivity, clear sound, online 3D gaming, high quality digital pics and improved battery life.

Let us check out some of the cool features of Snapdragon 810:

1. 4K Ultra HD support

It helps in capturing, playing back and streaming top-quality 4K multi-media content on the device screen or an Ultra HD monitor.

 

2. Dolby Atmos technology

This technology uses special sound-enhancing techniques to attain rich and deep spacial characteristics and offer an immersive audio experience.

 

3. Computational optical zoom

Qualcomm uses Corephotonics’ LTD Dual Camera solution in Snapdragon 810 that combines its proprietary tele lens and a standard wide lens to allow 5x optical zoom in videos and 3x optical zoom in stills. Here, two camera images are combined into one better quality picture using image fusion technology of Corephotonics.

4. Noise cancellation and directional recording 

The Snapdragon 810 features a low-power, high performance noise cancellation technology wherein voice signals are isolated using the multi-microphone setup of Qualcomm. During a video recording, configurable listening zones enable users to capture only the audio that they want.

5. SafeSwitch technology

The Snapdragon 810 has been equipped with Qualcomm’s SafeSwitch technology. It protects the mobile device against its theft and data theft. It also allows users to lock/unlock their devices and its hardware verifies the input commands.

 

6. Sense Audio music detection with Shazam app

It has a Sense Audio engine that can detect unique environmental elements and deliver curated aural experience fitting the context. The Shazam music recognition app in it can be launched with a single tap on the button and allows user to discover, listen, purchase and share music.

7. Advanced Wi-Fi connectivity

The Snapdragon 810 has VIVE 11ac and 11ad technology offering high bandwidth and low latency connectivity. Its wireless docking facility allows users to remotely check emails and edit documents over the Internet. The chip’s modem allows file transfers at more than 4Gbit/s, even bigger files having 4K ultra high resolution content.

Via PhoneArena

Some cool features of Qualcomm’s 64-bit Snapdragon 810 processor

Samsung’s next Exynos chipset will reportedly feature a Cat.10 LTE Modem

The LTE Cat.6 technology has pretty much become the standard now for flagship phones of various mobile makers. Smartphones having LTE Cat.6 support can achieve download speeds of up to 300 MB per second. With the technology developing at a fast rate, speeds are rising.

Last month, Qualcomm had announced a new 5th gen LTE Cat.10 9×45 Gobi modem that supports download speeds of up to 450 Mbps and upload speeds of up to 100 Mbps. This download speed is 1.5 times faster and the upload speed is 2 times faster compared to LTE category 6. This Qualcomm LTE Cat.10 modem is expected to go commercial sometime in 2015.

Qualcomm has just announced that Snapdragon 810 SoC that will power most of the flagships coming out in 2015 will now support Cat.9 LTE offering download speeds of up to 450 Mbps. The new Cat.10 LTE modem will be seen in its subsequent variations.

A report from South Korean media says that Samsung is working on a new Exynos chipset that will have a 3-band Cat.10 LTE Modem on board capable of allowing speeds of up to 450 Mbps. It is also believed that the South Korean giant will manufacture the modem by itself. According to the report, Samsung will ship its devices carrying the Cat.10 LTE modem as early as next year. It is even speculated that Samsung Galaxy S6 would feature this modem in its Exynos variant.

The Exynos variant is usually made for Samsung’s South Korean market. Some of the South Korean mobile networks such as LG U+ are already improving their infrastructure to enable Cat.10 LTE speeds. So the timing seems just right and Samsung may very well introduce this new Exynos chipset with Cat.10 LTE Modem at the MWC in 2015.

Source News.Naver

Via G4Games

Samsung’s next Exynos chipset will reportedly feature a Cat.10 LTE Modem

Qualcomm’s new Cat. 10 LTE 9x45 modem has up to 450 Mbps download speed

Qualcomm Incorporated has announced that a new 5th gen LTE multimode Gobi 9×45 modem and a 2nd gen RF360 Envelope Tracker, the QFE3100 have been introduced by its wholly owned subsidiary Qualcomm Technologies. Both the products will work together to offer faster downloads and better thermal efficiency with optimum power consumption.

The new Category 10 LTE modem supports download speeds of up to 450 MB per second and upload speeds of up to 100 MB per second. The download speed is 1.5 times faster and the upload speed is 2 times faster than LTE Category 6. The connectivity is better and the application response time is also faster.

The new modem is based on the 2nd gen 20nm technology and supports all the major standards DC-HSPA, GSM, EVDO, CDMA 1x and TD-SCDMA  as well as all the main RF bands and band combinations. It also supports GPS, Galileo, Beidou and Glonass globally. LTE Dual SIM, VoL LTE and LTE Broadcast are also supported.

The QFE3100 Envelope Tracker is 30% smaller in size and improves the battery life. Paired together, the 9×45 modem and the QFE3100 offer a very advanced platform for 2G, 3G and 4G modes.

“The expansion of our connectivity solutions to include fifth-generation LTE Category 10 technology, and the QFE3100, will offer consumers more efficient mobile devices that connect seamlessly to the fastest LTE Advanced networks while consuming lower power,” said Cristiano Amon, executive vice president of Qualcomm Technologies.

“Today’s announcement builds on our established technology leadership in the LTE connectivity space and demonstrates our continued commitment to offering users an outstanding and unparalleled mobile experience,” he added.

The 9×45 modem and the QFE3100 Tracker are in the sampling phase and are expected to be available commercially in 2015.

Source: Qualcomm

Qualcomm’s new Cat. 10 LTE 9x45 modem has up to 450 Mbps download speed

Snapdragon 810 and 808 Devices Are Expected To Launch In First Half Of 2015

Qualcomm revealed its flagship 64-bit chipsets named as the Snapdragon 810 and 808 in April. According to the Qualcomm’s Senior Director of Marketing, the company has already sent the sample chipsets to the device makers and the first launch is expected in starting half of the next year.

Exynos 5433 of Samsung and Apple’s A8 made by TSMC are using the technology that will be used by the Snapdragon 810 and 808, i.e. 20nm process. The present Snapdragons are using 28nm process.

The two new chipsets, the Snapdragon 810 and 808, are supportive of both operating systems – 32-bit and 64-bit. The manufacturers will have the choice to select the one they like. Snapdragon will support 64-bit Android L from the start.

These new Qualcomm chipsets are not the only ones with 64-bit support; other chipsets to support it are the Snapdragon 410, 610 and 615. All new and old chipsets use ARM processor cores and not new Krait design.

Own GPU is used by Qualcomm. Adreno 430 is the GPU for the Snapdragon 810, when compared with the Adreno 420 present in Snapdragon 805, it will increase the 30% performance. In the Snapdragon 808, Adreno 418 can be found which is 30% better than the old Adreno 330.

These two new chipsets will support LPDDR4 RAM. These two have Category 6 LTE connectivity on the wireless side which is common as the Snapdragon 805. The demos of the Snapdragon 810 and 808 devices are expected at CES.

Snapdragon 810 and 808 Devices Are Expected To Launch In First Half Of 2015

Product Released: Qualcomm Snapdragon 210 processor

Qualcomm Technologies recently has announced its new product, Snapdragon 210 processor; along with the company’s first LTE-equipped table reference design and the latest 28 nm transceivers as well as the next-generation Qualcomm RF360 front end solutions. These new designs and technologies were developed to achieve a high performance standard of computing and connectivity for entry-level and mainstream smart phones and tablets.

Snapdragon 210 processor

The new processor will offer integrated multimode 3G/4G LTE and LTE Dual SIM for entry-level as its main feature. It boasts of seamless, advanced LTE connectivity with fully integrated 4G LTE-Advanced Cat 4 Carrier Aggregation, LTE Broadcast and LTE Dual SIM/ Dual standby.

Additional features include:

• High Quality but low cost Full-HD(1080P) playback multimedia experience.


• Higher performance but low power quad CPU and Qualcomm® Adreno™ 304 graphics.


• Enhanced camera capabilities including zero shutter lag, high dynamic range (HDR), auto focus, auto white balance and auto exposure.


• Faster battery charging, made possible because of Qualcomm® Quick Charge™ 2.0 support

Qualcomm Reference Design (QRD) version of Snapdragon 210 processor

It is available in both smart phones and tablet configurations. It will include the above-mentioned features alongside with an improved connectivity capabilities including integrated 4G LTE-Advanced Cat 4 Carrier Aggregation, RF transceiver chip WTR2955, and Qualcomm RF360 front end solution for multiband and multimode support.

Qualcomm Reference Design (QRD) version of Snapdragon 410 processor

It is also available in both smart phones and tablet configurations. It will include a high performance but low power quad core mobile computing, 64-bit, and the latest version of Android™. Better multimedia and graphics experience with Adreno 306 GPU. Integrated 4G LTE World Mode modem with CAT4 which boasts seamless communication in any location as well as its speed up to 150 Mbps.

28nm transceivers

28nm transceivers, WTR4905 and WTR2955 are paired with Snapdragon 410 and Snapdragon 210 respectively. Both designs are optimized to support LTE and LTE Advanced multimode device in the mid and entry tier.

Qualcomm RF360 front end solutions

It covers power amplifier and antenna switch solutions for both modular and integrated architectures. It aims to allow device makers to easily customize the LTE products which can be use for global and regional band combination without sacrificing the quality of the performance.

There are a few models of this product:

QFE 3320 – it can be optimized for regional band combinations for mid and entry-tier devices.

QFE 3335/ QFE 3345 – it is for power amplifier.

QFE 1035/ QFE 1045 – it is to add flexibility and simplify routing of 2X and 3X carrier aggregation to support all 3^rd Generation Partner Project (3GPP) approved LTE carrier aggregation band combination.

QFE 25XX – it is for antenna matching tuner which designed for stronger LTE connections when there is physical blockage such as the user’s head or hand.

The Snapdragon 210 processor and QRD reference tablet are expected to be launched in the first half of 2015 whereas the RF360 front end products are expected to be launched in the second half of 2014.

Product Released: Qualcomm Snapdragon 210 processor

Qualcomm gives assurance for a 64-bit Snapdragon powered handset at IFA 2014

The largest smartphone chipset maker Qualcomm today confirmed that a “Snapdragon powered multi-core 64-bit smartphone” is likely to be unveiled at the IFA 2014. However, the chipmaker did not provide much information but released a teaser image. Reports coming from the industry show that this chipset could be found in the upcoming HTC Desire 820.

Unlike the HTC Desire 510 that was announced this week with a 64-bit Snapdragon 410 processor, the HTC Desire 820 is expected to host an octa-core Snapdragon 615 CPU on-board. The Snapdragon 615 comprises of four Cortex A53 cores clocked at 1.8GHz and four Cortex A53 clocked at 1.0GHz. Now if this new chipset has to arrive with the HTC Desire 820, then we believe that to explore the capabilities of Snapdragon 615 the device should run the latest launched Android L.

With time tickling close to the commencement of IFA 2014 Berlin event next week, we expect a big news for this!

We’re thinking about your future: a #Snapdragon powered multi-core 64-bit smartphone is headed to @IFA_Berlin. pic.twitter.com/CS9w7HZGna

— Qualcomm (@Qualcomm) 28 agosto 2014

source: Qualcomm (Twitter)

Qualcomm gives assurance for a 64-bit Snapdragon powered handset at IFA 2014

Samsung And HiSilicon Planning to Increase Sell Of Their Handset Solutions

Samsung Electronics and HiSilicon Technologies have pace up their handset solutions development, according to a source. This includes the development of 8-core, 64-bit and 4G LTE enabled chips. Both companies are looking to sell more of their chips to other vendors.

LG Electronics, Sony Mobile Communications and HTC currently cover up 90% of their demand for handset solutions from Qualcomm. Also, Xiaomi Technology, ZTE, TCL, Coolpad, Lenovo and other Chinese vendors purchase large order of their chipsets from MediaTek and Qualcomm.

Handset vendors, for controlling production risk and product differentiation, are on the look for more chipset supplying companies so they can have more options while placing their order. This look for competitive chips offers have made it clear that these companies are not against buying chips from HiSilicon and Samsung, according to sources.

Samsung has increased the production of its Exynos family products. We have seen this already with the expansion of 6- and 8-core processors and Exynos ModAp LTE modern chips. Also, Samsung has launched reference designs supporting Exynos CPUs as a way for competing with MediaTek’s and Qualcomm reference designs. The source indicates that Meizu, the Chinese Smartphone vendor, has approved Exynos CPUs to be used in its MX-series flagship modes.

Kirin 920 processors launched by HiSilicon supporting LTE Cat.6 technology is used by the Huawei (HiSilicon parent company) in its Honor 6 Smartphone. Huawei is expected to utilize the chip in its mid and high range Ascend series. It is also noted by the source that HiSilicon is looking to sell the chips to other vendors as well.

Samsung And HiSilicon Planning to Increase Sell Of Their Handset Solutions

A new patent for the Galaxy Note S Pen filed

Korean tech giant Samsung has filed a new patent for the Galaxy Note S Pen feature which comes with Note series of handsets. Samsung has filed this patent in its hometown of Korea which shows that the company is working upon a method that could recognize the pen input via ultrasonic sensors rather than a digitizer. The patent reports that there will be three sensors which will record two dimensional data while additional 4 sensors would be pitched to record three dimensional data.

This is surely not for the first time that we are hearing of such kind of technology. Earlier back at the CES event this year, chip making giant Qualcomm had show this feature and has been seen in its MDP tablet designed by the company itself. With the use of this ultrasonic sensors, the need for digitizers will be nil which could help in getting the device slimmer by nearly a millimeter. Moreover, bringing this new technology in action would also help OEM to reduce manufacturing cost of the device. Here is video released earlier by Qualcomm that shows ultrasonic touch technology. Let’s hope that we get to see the first glimpse of this tech in the much rumored upcoming Galaxy Note 4.

Source

A new patent for the Galaxy Note S Pen filed

Samsung announces its first integrated LTE enabled chipset Exynos ModAP

Well, to date, currently Qualcomm is considered as a pioneer and leader in creating integrated LTE chipsets currently. Well as spotted yesterday, now it seems that Samsung is next to enter the competition and has today unveiled the Exynos ModAP chipset that comes with LTE Cat 4 capable chipset. ModAP means that it is a “Modem” and “Applications processor” which suggest that Samsung now has moved ahead from the setups where the modem was a separate part of the chip.

28nm HKMG process is a technique used to build the Exynos ModAP where the processor supports Heterogeneous Multi-Processing. This means that the chipset will allow all of its eight cores to function simultaneously. This newly launched chipset from Samsung also supports carrier aggregation that merges multiple channels in order to achieve the LTE Cat 4 thereby offering speeds of 50Mbps uplink and 150Mbps downlink. Apart from this, the modem also supports TDD and FDD, 2G, 3G along with TD-SCDMA.

Moreover, the chipset can even record videos of 2160p resolution at 30fps with a very speedy 6.4GB/s of channel RAM. Get to know the prowess of the Exynos chips from Samsung in much detail from its official website.

Samsung announces its first integrated LTE enabled chipset Exynos ModAP